R-LOGITECH
BOND
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Financial Reports
Press Contact
Frank Ostermair/Linh Chung
Better Orange IR & HV AG
+49 (0) 89 889 69 06 25
linh.chung@better-orange.de
Better Orange IR & HV AG
+49 (0) 89 889 69 06 25
linh.chung@better-orange.de
KEY DATA BOND 2018/2023
| Issuer | R-LOGITECH S.A.M. |
| Issued amount | EUR 200 million |
| WKN/ISIN | A19WVN/DE000A19WVN8 |
| Coupon | 8.5 % p.a. |
| Issue price | 100 % |
| Term | 5 years |
| Value date | 29 March 2018 |
| Interest payment | Annually in arrears on 29 March of each year (in 2019 for the first time) |
| Redemption price | 100 % |
| Redemption date | 29 March 2023 |
| Denomination | EUR 1,000 |
| Status | Unsubordinated, unsecured |
| Covenants | Negative pledge, change of control, cross-default, 50% limitation on dividend |
| Documentation | Approved prospectus in Luxembourg with notification to Germany (BaFin) |
| Stock exchange | Open Market of Deutsche Börse AG ("Freiverkehr" of the Frankfurt Stock Exchange) |
| Global Coordinator & Bookrunner | BankM - Repräsentanz der FinTech Group Bank AG |
FINANCIAL CALENDAR
| 29 March 2022 | Interest payment for the bond 2018/2023 (ISIN: DE000A19WVN8) |
| 28 April 2022 | Annual report 2021 |
| 11 August 2022 | Half-year report 2022 |
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